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"The CAE staff will provide mold filling analysis service to ensure product quality and performance."
 
   
 

Our years of plastic engineering knowledge and tooling experience combined with the latest technical advancements provide you with cost-effective and efficient service processes and solutions. We are recognized leaders in providing analytical services in mold filling, mold cooling, shrink & wrap analysis, gas analysis and other services.

Mold Filling Analysis Services
With our state-of-the-art systems and Computer-Aided Engineering (CAE) staff modeling your parts, we can simulate processing performance and conditions prior to development. Our modeling system offers you:

  • Product assembly analysis
  • Multiple gating options
  • Wall stock comparisons
  • Optimum balance of filling pattern and pressure distribution
  • Alternative material comparisons
  • Knit line formation and direction

Mold Cooling Analysis Services
In order to achieve superior part quality, we recommend conducting a cooling analysis. We assure you that the cooling analysis will assist in perfecting design development. You can monitor and compare the different layouts to achieve:

  • Quick and even cooling process
  • Minimum mold temperature differences
  • Faster cycle time
  • Cost-effective tooling
  • Efficient program development time
  • Uniformity from core to cavity temperatures
  • Balance flow rate
  • Minimum in-process scrap
  • Better dimensional stability and control
  • Energy savings

Other Services
Over the years, the Plastic Engineering & Technical Services team has found the need to provide additional services to support your mold making and injection molding needs. These services have been tested and measured to ensure you receive an in-depth product analysis at a faster rate assisting you to build your product to meet or exceed your customer needs:

  • Optimize Processing
  • Optimize Filling
  • Wall Stock Thickness Analysis
  • Knit Line Formulation/Location
  • Multiple Gate Options and Placement
  • Gate Placement and Sequencing
  • Material Options
  • Processing Alternatives